HPCA 2018


24th IEEE International Symposium on High-Performance Computer Architecture


February/March 2018

Vienna, Austria



Call For Paper

The International Symposium on High-Performance Computer Architecture provides a high-quality forum for scientists and engineers to present their latest research findings in this rapidly-changing field. Authors are invited to submit papers on all aspects of high-performance computer architecture. Topics of interest include, but are not limited to:

Processor, cache, and memory architectures

Parallel computer architectures

Multicore and multiprocessor architectures

Impact of technology on architecture

Dependable/secure architectures

High-performance I/O systems

Embedded, reconfigurable, and heterogeneous architectures

Interconnect and network interface architectures

Architectures for cloud-based HPC and data centers

Innovative hardware/software trade-offs

Impact of compilers and system software on architecture

Performance modeling and evaluation

Architecture for novel application workloads, such as AI or graph analytics

Architectures for emerging technology and applications

Authors should submit an abstract by July 25, 2017 11:59 PM CDT. They should submit the full version of the paper August 1, 2017, 11:59 PM CDT. No extensions will be granted. The full version should be a PDF file following the submission guidelines that will be made available at the submission website. Papers should be submitted for blind review. New-idea papers as well as papers that significantly advance established areas are strongly encouraged. Submission issues should be directed to the program chair Yuan Xie at yuanxie@ece.ucsb.edu. HPCA-24 will host an Industrial Paper Session presenting novel insights from industry. See the HPCA 2018 website at http://hpca2018.ece.ucsb.edu for additional information about HPCA 2018 and submission details.

General Chair: Michael Gschwind (IBM Corp.)

Program Chair: Yuan Xie (UCSB)

Important Dates:

Abstract submission: July 25, 2017 ; Full paper submission : August 1, 2017